Thin Wafer Market by Wafer Size (125mm, 200mm, 300mm), Process (Temporary Bonding & Debonding, Carrier-less/Taiko Process), Application (MEMS, CMOS Image Sensor, Memory, RF Devices, LED, Interposer, Logic), and Region – Global Trend and 2020 to 2025

$3,850.00$5,850.00

AVAIL 20% DISCOUNT ON PURCHASE OF ANY REPORT
Published on: April 6, 2020
Clear
SKU: GMS-567 Category:

The thin wafer market is expected to hit USD 10.1 billion by 2025, rising between 2020 and 2025 at a CAGR of 3.21%. The increasing demand for semiconductor devices in a variety of vertical industries such as automotive, consumer electronics, and telecommunications, among others, serves as one of the most significant drivers of the thin wafer market’s rise.

Thin Wafer Market by Wafer Size (125mm, 200mm, 300mm), Process (Temporary Bonding & Debonding, Carrier-less/Taiko Process), Application (MEMS, CMOS Image Sensor, Memory, RF Devices, LED, Interposer, Logic), and Region - Global Trend and 2020 to 2025 1

Thin Wafer Market by Wafer Size (125mm, 200mm, 300mm), Process (Temporary Bonding & Debonding, Carrier-less/Taiko Process), Application (MEMS, CMOS Image Sensor, Memory, RF Devices, LED, Interposer, Logic), and Region - Global Trend and 2020 to 2025 2

Thin Wafer Market by Wafer Size (125mm, 200mm, 300mm), Process (Temporary Bonding & Debonding, Carrier-less/Taiko Process), Application (MEMS, CMOS Image Sensor, Memory, RF Devices, LED, Interposer, Logic), and Region - Global Trend and 2020 to 2025 3

Thin Wafer Market by Wafer Size (125mm, 200mm, 300mm), Process (Temporary Bonding & Debonding, Carrier-less/Taiko Process), Application (MEMS, CMOS Image Sensor, Memory, RF Devices, LED, Interposer, Logic), and Region - Global Trend and 2020 to 2025 4

Thin Wafer Market by Wafer Size (125mm, 200mm, 300mm), Process (Temporary Bonding & Debonding, Carrier-less/Taiko Process), Application (MEMS, CMOS Image Sensor, Memory, RF Devices, LED, Interposer, Logic), and Region - Global Trend and 2020 to 2025 5

Thin Wafer Market by Wafer Size (125mm, 200mm, 300mm), Process (Temporary Bonding & Debonding, Carrier-less/Taiko Process), Application (MEMS, CMOS Image Sensor, Memory, RF Devices, LED, Interposer, Logic), and Region - Global Trend and 2020 to 2025 6

Thin Wafer Market by Wafer Size (125mm, 200mm, 300mm), Process (Temporary Bonding & Debonding, Carrier-less/Taiko Process), Application (MEMS, CMOS Image Sensor, Memory, RF Devices, LED, Interposer, Logic), and Region - Global Trend and 2020 to 2025 7

Thin Wafer Market by Wafer Size (125mm, 200mm, 300mm), Process (Temporary Bonding & Debonding, Carrier-less/Taiko Process), Application (MEMS, CMOS Image Sensor, Memory, RF Devices, LED, Interposer, Logic), and Region - Global Trend and 2020 to 2025 8

1 Global Thin Wafer Market
1.1 Study Objectives
1.2 Market Definition
1.3 Study Scope
1.3.1 Markets Covered
1.3.2 Geographic Scope

2 RESEARCH METHODOLOGY
2.1 Research Data
2.1.1 Secondary Data
2.1.1.1 Key Data From Secondary Sources
2.1.2 Primary Data
2.1.2.1 Key Data From Primary Sources
2.1.2.2 Key Industry Insights
2.1.2.3 Breakdown of Primaries
2.2 Market Size Estimation
2.2.1 Bottom-Up Approach
2.2.2 Top-Down Approach
2.3 Market Breakdown and Data Triangulation
2.4 Research Assumptions

3 Global Thin Wafer Market – Executive Summary
3.1 Market Revenue, Market Size and Key Trends by Company
3.2 Key Trends by type of Application
3.3 Key Trends segmented by Geography

4 Global Thin Wafer Market – Comparative Analysis
4.1 Product Benchmarking – Top 10 companies
4.2 Top 5 Financials Analysis
4.3 Market Value split by Top 10 companies
4.4 Patent Analysis – Top 10 companies
4.5 Pricing Analysis

5 Global Thin Wafer Market – Industry Market Entry Scenario
5.1 Regulatory Framework Overview
5.2 New Business and Ease of Doing business index
5.3 Case studies of successful ventures
5.4 Customer Analysis – Top 10 companies

6 Global Thin Wafer Market – Market Forces
6.1 Introduction
6.2 Market Dynamics
6.2.1 Drivers
6.2.2 Opportunities
6.2.3 Challenges
6.3 Porters Analysis of Market
6.3.1 Bargaining power of suppliers
6.3.2 Bargaining powers of customers
6.3.3 Threat of new entrants
6.3.4 Rivalry among existing players
6.3.5 Threat of substitutes

7 Global Thin Wafer Market – Strategic Analysis
7.1 Value Chain analysis
7.2 Product Life Cycle
7.3 Supplier and distributor analysis (Market share and product dealing strategies)

8 Global Thin Wafer Market – By Wafer Size (Market Size – & million/billion)
8.1 125mm
8.2 200mm
8.3 300mm

9 Global Thin Wafer Market – By Process
9.1 Temporary Bonding & Debonding
9.2 Carrier–Less Approach (Taiko Process)

10 Global Thin Wafer Market – By Application
10.1 MEMS
10.2 CMOS Image Sensors
10.3 Memory
10.4 RF Devices
10.5 LEDs
10.6 Interposers
10.7 Logic

11 Global Thin Wafer Market – By Geography (Market Size – & million/billion)
11.1 Introduction
11.2 North America
11.2.1 US
11.2.2 Canada
11.2.3 Mexico
11.3 Europe
11.3.1 U.K
11.3.2 Germany
11.3.3 Italy
11.3.4 France
11.3.5 Spain
11.3.6 Rest of Europe
11.4 Asia-Pacific
11.4.1 China
11.4.2 Japan
11.4.3 India
11.4.4 South Korea
11.4.5 Rest of APAC
11.5 Rest of the World
11.5.1 South America
11.5.2 Middle East
11.5.3 Africa

12 Global Thin Wafer Market – Entropy
12.1 New product launches
12.2 M&A’s, collaborations, JVs and partnerships

13 Global Thin Wafer Market Company Profile (Key Players)
13.1 Market Share, Company Revenue, Products, M&A, Developments
13.2 LG Siltron Inc.
13.3 Disco Corporation
13.4 3M
13.5 Applied Materials, Inc.
13.6 Shin-Etsu Chemical Co., Ltd.
13.7 Sumco Corporation
13.8 Sunedison Semiconductor Ltd.
13.9 Siltronic AG
13.10 Süss Micro Tec AG
13.11 Lintec Corporation
13.12 Company 11 & more

14 Global Thin Wafer Market – Appendix
14.1 Sources
14.2 Abbreviations