OVERVIEW
Research by Global Market Studies has reported a CAGR of 13.6% for the Molded Interconnect Device Market, expecting to expand to a value of USD 2.7 billion by 2028.Â
A Molded Interconnect Device (MID) is a specialized type of electronic component or device that combines both mechanical and electrical functionalities into a single, three-dimensional structure. MIDs are manufactured using injection molding technology and allow for the integration of circuit traces, conductive pathways, and mechanical features directly into the 3D structure of the component.
MIDs are used in various consumer electronics, automotive, medical devices, industrial equipment, aerospace and defense, IoT, wearable technology, telecommunications, LED lighting, and consumer appliances for space-saving designs, increased functionality, and streamlined assembly processes. They also contribute to lightweight and integrated solutions in IoT ecosystems.
Table of Content
Market Dynamics
Drivers:
MIDs offer numerous benefits, including miniaturization, space efficiency, reduced assembly steps, design flexibility, weight reduction, cost efficiency, reliability, and environmental benefits. They enable the integration of electronic and mechanical components in a compact space, reducing assembly time and complexity. Design flexibility allows designers to create complex 3D shapes that combine multiple functions, promoting innovative product designs and improved aesthetics.Â
Weight reduction is crucial in applications like aerospace, automotive, and wearables, and MIDs offer lightweight solutions. Cost efficiency is achieved through reduced assembly steps and simplified designs, while reliability is enhanced by fewer interconnects and solder joints. Additionally, MIDs reduce material waste and energy consumption during manufacturing due to their streamlined design and fewer assembly steps.
Opportunities:
MIDs enable designers to create custom-shaped components with integrated electronics, enabling the development of functional prototypes. These components offer integrated functionality, space optimization, simplified assembly, customization, multi-material integration, reduced interconnects, cost-effective mass production, and environmental benefits.
 They can combine various materials, such as plastics and conductive materials, in a single molded structure, resulting in versatile designs. The integration of circuitry directly into the component structure reduces the need for external wiring, improving signal integrity and reliability. MIDs also contribute to more sustainable manufacturing processes by minimizing material waste and energy consumption. Additionally, MIDs enable designers to think beyond the limitations of traditional PCBs, leading to innovative and visually appealing product designs.
Restraints:
MIDs offer design flexibility but can be challenging due to their design complexity, initial costs, material limitations, testing and inspection challenges, repair and modification challenges, limited supplier base, and standardization challenges. Design complexity, initial costs, and material limitations can deter some companies from adopting MIDs.Â
Integrated designs in MIDs can make it difficult to access and test individual components, increasing the complexity of testing and inspection processes. Repair and modification can be challenging due to the integrated design, and a limited supplier base may impact sourcing and production timelines. Standardization challenges may hinder interoperability and make it harder to switch suppliers or scale production.
Regional Information:
North America:The United States has a growing interest in MIDs, with applications in industries like consumer electronics, aerospace, and medical devices. Silicon Valley and other tech hubs have been drivers of innovation in MID technology.
Europe: Germany, in particular, has been a significant player in the MID market due to its strong manufacturing base and emphasis on technological innovation. The automotive and industrial sectors have been prominent users of MIDs in Europe.
Asia-Pacific: Countries like Japan, South Korea, and China have shown interest in MIDs due to their advanced electronics and manufacturing industries. The Asia-Pacific region is a hub for consumer electronics, automotive, and telecommunications, which are key markets for MIDs.
Recent Developments:
• In May 2022, Taoglas has signed a partnership agreement with Dejerao. The company will help Dejerao’s customers by providing best-in-class RF antennas for cellular bonding devices used in mobile applications.
• In April 2022, Phillips-Medisize, a Molex company, has collaborated with SOTECH Health to develop a breath sensor system that detects COVID-19 in less than 30 seconds. Phillips-Medisize will help with its human-centric product design, rapid prototyping, and end-to-end manufacturing expertise.
• In March 2022, Amphenol Corporation has expanded its SURLOK Plus Series to include 8 mm and 10.3 mm right-angle connectors, with a voltage range of 1500 VDC to meet energy storage and high-power connection and transfer requirements.
Key Players:
Molex, TE Connectivity, Amphenol, LPKF Laser & Electronics, Taoglas, Harting, Arlington Plating Company, MID Solutions, 2E Mechatronic, Kyocera AVX, and Johnan.
Frequently Asked Questions
1) What is the projected market value of the Molded Interconnect Device Market?
– The Molded Interconnect Device Market is expected to reach a value of USD 2.7 billion by 2028.
2) What is the estimated CAGR of the Molded Interconnect Device Market over the 2023 to 2028 forecast period?
– The Molded Interconnect Device Market is expected to grow at a CAGR of approximately 13.6% from 2023 to 2028.
3) Who are the key players in the Molded Interconnect Device Market?
– Molex, TE Connectivity, Amphenol, LPKF Laser & Electronics, Taoglas, Harting, Arlington Plating Company, MID Solutions, 2E Mechatronic, Kyocera AVX, and Johnan.Â
4) What are the drivers for the Molded Interconnect Device Market?
– MIDs provide miniaturization, space efficiency, design flexibility, weight reduction, cost efficiency, reliability, and environmental benefits by integrating electronic and mechanical components, simplifying designs, and reducing material waste.
5) What are the restraints and challenges in the Molded Interconnect Device Market?
– MIDs offer design flexibility but face challenges like design complexity, initial costs, material limitations, testing, inspection, repair, modification, limited supplier base, and standardization.
6) What are the key applications and offerings of the Molded Interconnect Device Market?
– For space-saving designs, functionality, and streamlined assembly processes, MIDs are utilised in consumer electronics, automotive, medical devices, industrial equipment, aerospace, defence, IoT, wearable technology, telecommunications, LED lighting, and consumer appliances.
7) Which region is expected to drive the market for the forecast period?
– Europe has the highest value share in the global market and is expected to dominate shares in forecast period.
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