Flip Chip Technology Market by Wafer Bumping Process (CU Pillar, Lead-Free), Packaging Technology (2D IC, 2.5D IC, 3D IC), Packaging Type (BGA, PGA, LGA, SIP, CSP), Product (Memory, LED, CPU, GPU, SOC), Application and Geography – 2020 to 2025

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Published on: April 6, 2020
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The Global Flip Chip Technology Market is expected to hit USD 33.53 billion by 2025, growing with a CAGR of 5.59% during the forecast period. Factors such as increasing demand for wearable devices, strong growth in MMIC (Monolithic Microwave IC) Applications are driving demand for Flip Chip Technology Market.

Flip Chip Technology Market by Wafer Bumping Process (CU Pillar, Lead-Free), Packaging Technology (2D IC, 2.5D IC, 3D IC), Packaging Type (BGA, PGA, LGA, SIP, CSP), Product (Memory, LED, CPU, GPU, SOC), Application and Geography - 2020 to 2025 1

Flip Chip Technology Market by Wafer Bumping Process (CU Pillar, Lead-Free), Packaging Technology (2D IC, 2.5D IC, 3D IC), Packaging Type (BGA, PGA, LGA, SIP, CSP), Product (Memory, LED, CPU, GPU, SOC), Application and Geography - 2020 to 2025 2

Flip Chip Technology Market by Wafer Bumping Process (CU Pillar, Lead-Free), Packaging Technology (2D IC, 2.5D IC, 3D IC), Packaging Type (BGA, PGA, LGA, SIP, CSP), Product (Memory, LED, CPU, GPU, SOC), Application and Geography - 2020 to 2025 3

Flip Chip Technology Market by Wafer Bumping Process (CU Pillar, Lead-Free), Packaging Technology (2D IC, 2.5D IC, 3D IC), Packaging Type (BGA, PGA, LGA, SIP, CSP), Product (Memory, LED, CPU, GPU, SOC), Application and Geography - 2020 to 2025 4

Flip Chip Technology Market by Wafer Bumping Process (CU Pillar, Lead-Free), Packaging Technology (2D IC, 2.5D IC, 3D IC), Packaging Type (BGA, PGA, LGA, SIP, CSP), Product (Memory, LED, CPU, GPU, SOC), Application and Geography - 2020 to 2025 5

Flip Chip Technology Market by Wafer Bumping Process (CU Pillar, Lead-Free), Packaging Technology (2D IC, 2.5D IC, 3D IC), Packaging Type (BGA, PGA, LGA, SIP, CSP), Product (Memory, LED, CPU, GPU, SOC), Application and Geography - 2020 to 2025 6

Flip Chip Technology Market by Wafer Bumping Process (CU Pillar, Lead-Free), Packaging Technology (2D IC, 2.5D IC, 3D IC), Packaging Type (BGA, PGA, LGA, SIP, CSP), Product (Memory, LED, CPU, GPU, SOC), Application and Geography - 2020 to 2025 7

Flip Chip Technology Market by Wafer Bumping Process (CU Pillar, Lead-Free), Packaging Technology (2D IC, 2.5D IC, 3D IC), Packaging Type (BGA, PGA, LGA, SIP, CSP), Product (Memory, LED, CPU, GPU, SOC), Application and Geography - 2020 to 2025 8

1 Global Flip Chip Technology Market
1.1 Study Objectives
1.2 Market Definition
1.3 Study Scope
1.3.1 Markets Covered
1.3.2 Geographic Scope

2 RESEARCH METHODOLOGY
2.1 Research Data
2.1.1 Secondary Data
2.1.1.1 Key Data from Secondary Sources
2.1.2 Primary Data
2.1.2.1 Key Data from Primary Sources
2.1.2.2 Key Industry Insights
2.1.2.3 Breakdown of Primaries
2.2 Market Size Estimation
2.2.1 Bottom-Up Approach
2.2.2 Top-Down Approach
2.3 Market Breakdown and Data Triangulation
2.4 Research Assumptions

3 Global Flip Chip Technology Market – Executive Summary
3.1 Market Revenue, Market Size and Key Trends by Company
3.2 Key Trends by type of Application
3.3 Key Trends segmented by Geography

4 Global Flip Chip Technology Market – Comparative Analysis
4.1 Product Benchmarking – Top 10 companies
4.2 Top 5 Financials Analysis
4.3 Market Value split by Top 10 companies
4.4 Patent Analysis – Top 10 companies
4.5 Pricing Analysis

5 Global Flip Chip Technology Market – Industry Market Entry Scenario
5.1 Regulatory Framework Overview
5.2 New Business and Ease of Doing business index
5.3 Case studies of successful ventures
5.4 Customer Analysis – Top 10 companies

6 Global Flip Chip Technology Market – Market Forces
6.1 Introduction
6.2 Market Dynamics
6.2.1 Drivers
6.2.2 Opportunities
6.2.3 Challenges
6.3 Porters Analysis of Market
6.3.1 Bargaining power of suppliers
6.3.2 Bargaining powers of customers
6.3.3 Threat of new entrants
6.3.4 Rivalry among existing players
6.3.5 Threat of substitutes

7 Global Flip Chip Technology Market – Strategic Analysis
7.1 Value Chain analysis
7.2 Product Life Cycle
7.3 Supplier and distributor analysis (Market share and product dealing strategies)

8 Global Flip Chip Technology Market – By Product (Market Size – & million/billion)
8.1 CMOS Image Sensor
8.2 SoC
8.3 GPU
8.4 Memory
8.5 Light Emitting Diode
8.6 CPU

9 Global Flip Chip Technology Market – By Packaging Technology
9.1 CSP
9.2 BGA

10 Global Flip Chip Technology Market – By Wafer Bumping Process
10.1 Tin-Lead Eutectic Solder
10.2 Lead Free Solder
10.3 Copper Pillar
10.4 Gold Stud Bumping

11 Global Flip Chip Technology Market – By End User
11.1 Industrial
11.2 Automotive
11.3 Consumer Electronics
11.4 Military and Defense
11.5 Medical and Healthcare
11.6 Telecommunications

12 Global Flip Chip Technology Market – By Geography (Market Size – & million/billion)
12.1 Introduction
12.2 North America
12.2.1 US
12.2.2 Canada
12.2.3 Mexico
12.3 Europe
12.3.1 U.K
12.3.2 Germany
12.3.3 Italy
12.3.4 France
12.3.5 Spain
12.3.6 Rest of Europe
12.4 Asia-Pacific
12.4.1 China
12.4.2 Japan
12.4.3 India
12.4.4 South Korea
12.4.5 Rest of APAC
12.5 Rest of the World
12.5.1 South America
12.5.2 Middle East
12.5.3 Africa

13 Global Flip Chip Technology Market – Entropy
13.1 New product launches
13.2 M&A’s, collaborations, JVs and partnerships

14 Global Flip Chip Technology Market -Company Profile (Key Players)
14.1 Market Share, Company Revenue, Products, M&A, Developments
14.2 Amkor Technology Inc.
14.3 GlobalFoundries U.S. Inc.
14.4 Chipbond Technology Corporation
14.5 TF AMD Microlectronics Sdn Bhd
14.6 Powertech Technology Inc.
14.7 Jiangsu Changjiang Electronics Technology Co., Ltd.
14.8 UTAC Holdings Ltd
14.9 Taiwan Semiconductor Manufacturing Company Limited
14.10 ASE Industrial Holding Ltd. (Siliconware Precision Industries Co., Ltd)
14.11 Company 10
14.12 Company 11 & more

15 Global Flip Chip Technology Market – Appendix
15.1 Sources
15.2 Abbreviation