3D IC and 2.5D IC Market by Packaging Technology ( 3D TSV, 3D Wafer-Level Chip-Scale Packaging,2.5D), Application (Imaging & Optoelectronics, Logic, MEMS/Sensors, Memory, LED, Power), Region and End-User Industry – 2020 to 2025

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Published on: March 14, 2020
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The Global 3D IC and 2.5D IC Market is calculated to reach USD 176.56 billion by 2025, growing at a CAGR of 34.8% during the forecast period 2020-2025. The increasing need for advanced architecture in electronics products, trend of miniaturization of electronic devices, and growing market of tablet smartphones and gaming devices are the factors that will drive the market in near future.

3D IC and 2.5D IC Market by Packaging Technology ( 3D TSV, 3D Wafer-Level Chip-Scale Packaging,2.5D), Application (Imaging & Optoelectronics, Logic, MEMS/Sensors, Memory, LED, Power), Region and End-User Industry - 2020 to 2025 1

3D IC and 2.5D IC Market by Packaging Technology ( 3D TSV, 3D Wafer-Level Chip-Scale Packaging,2.5D), Application (Imaging & Optoelectronics, Logic, MEMS/Sensors, Memory, LED, Power), Region and End-User Industry - 2020 to 2025 2

3D IC and 2.5D IC Market by Packaging Technology ( 3D TSV, 3D Wafer-Level Chip-Scale Packaging,2.5D), Application (Imaging & Optoelectronics, Logic, MEMS/Sensors, Memory, LED, Power), Region and End-User Industry - 2020 to 2025 3

3D IC and 2.5D IC Market by Packaging Technology ( 3D TSV, 3D Wafer-Level Chip-Scale Packaging,2.5D), Application (Imaging & Optoelectronics, Logic, MEMS/Sensors, Memory, LED, Power), Region and End-User Industry - 2020 to 2025 4

3D IC and 2.5D IC Market by Packaging Technology ( 3D TSV, 3D Wafer-Level Chip-Scale Packaging,2.5D), Application (Imaging & Optoelectronics, Logic, MEMS/Sensors, Memory, LED, Power), Region and End-User Industry - 2020 to 2025 5

3D IC and 2.5D IC Market by Packaging Technology ( 3D TSV, 3D Wafer-Level Chip-Scale Packaging,2.5D), Application (Imaging & Optoelectronics, Logic, MEMS/Sensors, Memory, LED, Power), Region and End-User Industry - 2020 to 2025 6

3D IC and 2.5D IC Market by Packaging Technology ( 3D TSV, 3D Wafer-Level Chip-Scale Packaging,2.5D), Application (Imaging & Optoelectronics, Logic, MEMS/Sensors, Memory, LED, Power), Region and End-User Industry - 2020 to 2025 7

3D IC and 2.5D IC Market by Packaging Technology ( 3D TSV, 3D Wafer-Level Chip-Scale Packaging,2.5D), Application (Imaging & Optoelectronics, Logic, MEMS/Sensors, Memory, LED, Power), Region and End-User Industry - 2020 to 2025 8

1 Global 3D IC and 2.5D IC Market
1.1 Study Objectives
1.2 Market Definition
1.3 Study Scope
1.3.1 Markets Covered
1.3.2 Geographic Scope

2 RESEARCH METHODOLOGY
2.1 Research Data
2.1.1 Secondary Data
2.1.1.1 Key Data From Secondary Sources
2.1.2 Primary Data
2.1.2.1 Key Data From Primary Sources
2.1.2.2 Key Industry Insights
2.1.2.3 Breakdown of Primaries
2.2 Market Size Estimation
2.2.1 Bottom-Up Approach
2.2.2 Top-Down Approach
2.3 Market Breakdown and Data Triangulation
2.4 Research Assumptions

3 Global 3D IC and 2.5D IC Market – Executive Summary
3.1 Market Revenue, Market Size and Key Trends by Company
3.2 Key Trends by type of Application
3.3 Key Trends segmented by Geography

4 Global 3D IC and 2.5D IC Market – Comparative Analysis
4.1 Product Benchmarking – Top 10 companies
4.2 Top 5 Financials Analysis
4.3 Market Value split by Top 10 companies
4.4 Patent Analysis – Top 10 companies
4.5 Pricing Analysis

5 Global 3D IC and 2.5D IC Market – Industry Market Entry Scenario
5.1 Regulatory Framework Overview
5.2 New Business and Ease of Doing business index
5.3 Case studies of successful ventures
5.4 Customer Analysis – Top 10 companies

6 Global 3D IC and 2.5D IC Market – Market Forces
6.1 Introduction
6.2 Market Dynamics
6.2.1 Drivers
6.2.2 Opportunities
6.2.3 Challenges
6.3 Porters Analysis of Market
6.3.1 Bargaining power of suppliers
6.3.2 Bargaining powers of customers
6.3.3 Threat of new entrants
6.3.4 Rivalry among existing players
6.3.5 Threat of substitutes

7 Global 3D IC and 2.5D IC Market – Strategic Analysis
7.1 Value Chain analysis
7.2 Product Life Cycle
7.3 Supplier and distributor analysis (Market share and product dealing strategies)

8 Global 3D IC and 2.5D IC Market – By Packaging Technology (Market Size – & million/billion)
8.1 3D wafer-level chip-scale packaging
8.2 3D TSV
8.3 2.5D

9 Global 3D IC and 2.5D IC Market – By Application
9.1 Logic
9.2 Imaging & optoelectronics
9.3 Memory
9.4 MEMS/Sensors
9.5 LED
9.6 Power, analog & mixed signal, RF, photonics

10 Global 3D IC and 2.5D IC Market – By End-User
10.1 Consumer electronics
10.2 Telecommunication
10.3 Industry sector
10.4 Automotive
10.5 Military and Aerospace
10.6 Smart technologies
10.7 Medical devices

11 Global 3D IC and 2.5D IC Market – By Geography (Market Size – & million/billion)
11.1 Introduction
11.2 North America
11.2.1 US
11.2.2 Canada
11.2.3 Mexico
11.3 Europe
11.3.1 U.K
11.3.2 Germany
11.3.3 Italy
11.3.4 France
11.3.5 Spain
11.3.6 Rest of Europe
11.4 Asia-Pacific
11.4.1 China
11.4.2 Japan
11.4.3 India
11.4.4 South Korea
11.4.5 Rest of APAC
11.5 Rest of the World
11.5.1 South America
11.5.2 Middle East
11.5.3 Africa

12 Global 3D IC and 2.5D IC Market – Entropy
12.1 New product launches
12.2 M&A’s, collaborations, JVs and partnerships

13 Global 3D IC and 2.5D IC Market Company Profile (Key Players)
13.1 Market Share, Company Revenue, Products, M&A, Developments
13.2 Taiwan Semiconductor Manufacturing Company Limited (Taiwan)
13.3 Samsung Electronics Co., Ltd. (South Korea)
13.4 Toshiba Corp. (Japan)
13.5 ASE Group (Taiwan)
13.6 Broadcom Ltd. (Singapore)
13.7 Intel Corporation. (U.S.)
13.8 Jiangsu Changjiang Electronics Technology Co., Ltd (China)
13.9 Amkor Technology (U.S.)
13.10 Stmicroelectronics Nv (Switzerland).
13.11 United Microelectronics Corp. (Taiwan)
13.12 Company 11 & more

14 Global 3D IC and 2.5D IC Market – Appendix
14.1 Sources
14.2 Abbreviations