Flip Chip Technology Market by Wafer Bumping Process (Lead-Free, CU Pillar), Packaging Technology (2D IC, 2.5D IC, 3D IC), Product (LED, CPU, GPU, SOC, Memory), Packaging Type (LGA, SIP, BGA, PGA, CSP), Application and Geography – 2019 to 2024

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Published on: June 2, 2019
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The market for flip chip technology is projected to reach USD 33.4 billion by 2024, rising at a CAGR of 6.34% between 2019 and 2024. The rise in the market for flip chip technology is primarily due to the increasing demand for miniaturization and high performance in electronic devices and the heavy penetration of advanced packaging technology in the consumer electronics industry.

Flip Chip Technology Market by Wafer Bumping Process (Lead-Free, CU Pillar), Packaging Technology (2D IC, 2.5D IC, 3D IC), Product (LED, CPU, GPU, SOC, Memory), Packaging Type (LGA, SIP, BGA, PGA, CSP), Application and Geography - 2019 to 2024 1

Flip Chip Technology Market by Wafer Bumping Process (Lead-Free, CU Pillar), Packaging Technology (2D IC, 2.5D IC, 3D IC), Product (LED, CPU, GPU, SOC, Memory), Packaging Type (LGA, SIP, BGA, PGA, CSP), Application and Geography - 2019 to 2024 2

Flip Chip Technology Market by Wafer Bumping Process (Lead-Free, CU Pillar), Packaging Technology (2D IC, 2.5D IC, 3D IC), Product (LED, CPU, GPU, SOC, Memory), Packaging Type (LGA, SIP, BGA, PGA, CSP), Application and Geography - 2019 to 2024 3

Flip Chip Technology Market by Wafer Bumping Process (Lead-Free, CU Pillar), Packaging Technology (2D IC, 2.5D IC, 3D IC), Product (LED, CPU, GPU, SOC, Memory), Packaging Type (LGA, SIP, BGA, PGA, CSP), Application and Geography - 2019 to 2024 4

Flip Chip Technology Market by Wafer Bumping Process (Lead-Free, CU Pillar), Packaging Technology (2D IC, 2.5D IC, 3D IC), Product (LED, CPU, GPU, SOC, Memory), Packaging Type (LGA, SIP, BGA, PGA, CSP), Application and Geography - 2019 to 2024 5

Flip Chip Technology Market by Wafer Bumping Process (Lead-Free, CU Pillar), Packaging Technology (2D IC, 2.5D IC, 3D IC), Product (LED, CPU, GPU, SOC, Memory), Packaging Type (LGA, SIP, BGA, PGA, CSP), Application and Geography - 2019 to 2024 6

Flip Chip Technology Market by Wafer Bumping Process (Lead-Free, CU Pillar), Packaging Technology (2D IC, 2.5D IC, 3D IC), Product (LED, CPU, GPU, SOC, Memory), Packaging Type (LGA, SIP, BGA, PGA, CSP), Application and Geography - 2019 to 2024 7

Flip Chip Technology Market by Wafer Bumping Process (Lead-Free, CU Pillar), Packaging Technology (2D IC, 2.5D IC, 3D IC), Product (LED, CPU, GPU, SOC, Memory), Packaging Type (LGA, SIP, BGA, PGA, CSP), Application and Geography - 2019 to 2024 8

1 Global Flip Chip Technology Market
1.1 Study Objectives
1.2 Market Definition
1.3 Study Scope
1.3.1 Markets Covered
1.3.2 Geographic Scope

2 RESEARCH METHODOLOGY
2.1 Research Data
2.1.1 Secondary Data
2.1.1.1 Key Data From Secondary Sources
2.1.2 Primary Data
2.1.2.1 Key Data From Primary Sources
2.1.2.2 Key Industry Insights
2.1.2.3 Breakdown of Primaries
2.2 Market Size Estimation
2.2.1 Bottom-Up Approach
2.2.2 Top-Down Approach
2.3 Market Breakdown and Data Triangulation
2.4 Research Assumptions

3 Global Flip Chip Technology Market – Executive Summary
3.1 Market Revenue, Market Size and Key Trends by Company
3.2 Key Trends by type of Application
3.3 Key Trends segmented by Geography

4 Global Flip Chip Technology Market – Comparative Analysis
4.1 Product Benchmarking – Top 10 companies
4.2 Top 5 Financials Analysis
4.3 Market Value split by Top 10 companies
4.4 Patent Analysis – Top 10 companies
4.5 Pricing Analysis

5 Global Flip Chip Technology Market – Industry Market Entry Scenario
5.1 Regulatory Framework Overview
5.2 New Business and Ease of Doing business index
5.3 Case studies of successful ventures
5.4 Customer Analysis – Top 10 companies

6 Global Flip Chip Technology Market – Market Forces
6.1 Introduction
6.2 Market Dynamics
6.2.1 Drivers
6.2.2 Opportunities
6.2.3 Challenges
6.3 Porters Analysis of Market
6.3.1 Bargaining power of suppliers
6.3.2 Bargaining powers of customers
6.3.3 Threat of new entrants
6.3.4 Rivalry among existing players
6.3.5 Threat of substitutes

7 Global Flip Chip Technology Market – Strategic Analysis
7.1 Value Chain analysis
7.2 Product Life Cycle
7.3 Supplier and distributor analysis (Market share and product dealing strategies)

8 Global Flip Chip Technology Market – By Wafer Bumping Process (Market Size – &
million/billion)
8.1 Copper (Cu) pillar
8.2 Lead-free
8.3 Tin/lead eutectic solder
8.4 Gold stud+ plated solder

9 Global Flip Chip Technology Market – By Packaging Technology
9.1 2D IC
9.2 2.5D IC
9.3 3D IC

10 Global Flip Chip Technology Market – By Packaging Type
10.1 FC BGA
10.2 FC PGA
10.3 FC LGA
10.4 FC QFN
10.5 FC SiP
10.6 FC CSP

11 Global Flip Chip Technology Market – By Product
11.1 Memory
11.2 LED
11.3 CMOS Image sensor
11.4 RF, analog, mixed signal, and power IC
11.5 CPU
11.6 SoC
11.7 GPU

12 Global Flip Chip Technology Market – By Application
12.1 Consumer electronics
12.2 Telecommunication
12.3 Automotive
12.4 Industrial sector
12.5 Medical devices
12.6 Smart technologies
12.7 Military & Aerospace

13 Global Flip Chip Technology Market – By Geography (Market Size – & million/billion)
13.1 Introduction
13.2 North America
13.2.1 US
13.2.2 Canada
13.2.3 Mexico
13.3 Europe
13.3.1 U.K
13.3.2 Germany
13.3.3 Italy
13.3.4 France
13.3.5 Spain
13.3.6 Rest of Europe
13.4 Asia-Pacific
13.4.1 China
13.4.2 Japan
13.4.3 India
13.4.4 South Korea
13.4.5 Rest of APAC
13.5 Rest of the World
13.5.1 South America
13.5.2 Middle East
13.5.3 Africa

14 Global Flip Chip Technology Market – Entropy
14.1 New product launches
14.2 M&A’s, collaborations, JVs and partnerships

15 Global Flip Chip Technology Market Company Profile (Key Players)
15.1 Market Share, Company Revenue, Products, M&A, Developments
15.2 Jiangsu Changjiang Electronics Technology Co., Ltd
15.3 Taiwan Semiconductor Manufacturing Company Limited (TSMC Ltd.)
15.4 Samsung Electronics Co., Ltd.
15.5 Intel Corp.
15.6 Stats Chippac Ltd.
15.7 United Microelectronics Corp.
15.8 Amkor Technology
15.9 Siliconware Precision Industries Co., Ltd.
15.10 ASE Group
15.11 Powertech Technology, Inc.
15.12 Company 11 & more

16 Global Flip Chip Technology Market – Appendix
16.1 Sources
16.2 Abbreviations