OVERVIEW

The MID market is expected to hit USD 1,945 million by 2027, with a CAGR growth of 14.35 per cent from 2022 to 2027. Major factors driving the growth of this market include the the use of MIDs in medical devices, increasing demand for miniaturization in the consumer electronics industry and a growing need to minimize e-waste.

TABLE OF CONTENT

• 2 RESEARCH METHODOLOGY
  • 2.1 Research Data
    • 2.1.1 Secondary Data
      • 2.1.1.1 Key Data From Secondary Sources
    • 2.1.2 Primary Data
      • 2.1.2.1 Key Data From Primary Sources
      • 2.1.2.2 Key Industry Insights
      • 2.1.2.3 Breakdown of Primaries
  • 2.2 Market Size Estimation
    • 2.2.1 Bottom-Up Approach
    • 2.2.2 Top-Down Approach
  • 2.3 Market Breakdown and Data Triangulation
  • 2.4 Research Assumptions

• 3 Global Molded Interconnect Device (MID) Market ? Executive Summary
  • 3.1 Market Revenue, Market Size and Key Trends by Company
  • 3.2 Key Trends by type of Application
  • 3.3 Key Trends segmented by Geography

• 4 Global Molded Interconnect Device (MID) Market ? Comparative Analysis
  • 4.1 Product Benchmarking - Top 10 companies
  • 4.2 Top 5 Financials Analysis
  • 4.3 Market Value split by Top 10 companies
  • 4.4 Patent Analysis - Top 10 companies
  • 4.5 Pricing Analysis

• 5 Global Molded Interconnect Device (MID) Market ? Industry Market Entry Scenario
  • 5.1 Regulatory Framework Overview
  • 5.2 New Business and Ease of Doing business index
  • 5.3 Case studies of successful ventures
  • 5.4 Customer Analysis ? Top 10 companies

• 6 Global Molded Interconnect Device (MID) Market - Market Forces
  • 6.1 Introduction
  • 6.2 Market Dynamics
    • 6.2.1 Drivers
    • 6.2.2 Opportunities
    • 6.2.3 Challenges
  • 6.3 Porters Analysis of Market
    • 6.3.1 Bargaining power of suppliers
    • 6.3.2 Bargaining powers of customers
    • 6.3.3 Threat of new entrants
    • 6.3.4 Rivalry among existing players
    • 6.3.5 Threat of substitutes

• 7 Global Molded Interconnect Device (MID) Market - Strategic Analysis
  • 7.1 Value Chain analysis
  • 7.2 Product Life Cycle
  • 7.3 Supplier and distributor analysis (Market share and product dealing strategies)

• 8 Global Molded Interconnect Device (MID) Market ? By Process (Market Size ? &million/billion)
  • 8.1 Laser Direct Structuring
  • 8.2 2-Shot Molding
  • 8.3 Film Techniques

• 9 Global Molded Interconnect Device (MID) Market - By Product Type
  • 9.1 Antennae & Connectivity Modules
  • 9.2 Connectors & Switches
  • 9.3 Sensors
  • 9.4 Lighting
  • 9.5 Others

• 10 Global Molded Interconnect Device (MID) Market - By Industry
  • 10.1 Telecommunications
  • 10.2 Consumer Electronics
  • 10.3 Medical
  • 10.4 Automotive
  • 10.5 Industrial

• 11 Global Molded Interconnect Device (MID) Market ? By Geography (Market Size ? &million/billion)
  • 11.1 Introduction
  • 11.2 North America
    • 11.2.1 US
    • 11.2.2 Canada
    • 11.2.3 Mexico
  • 11.3 Europe
    • 11.3.1 U.K
    • 11.3.2 Germany
    • 11.3.3 Italy
    • 11.3.4 France
    • 11.3.5 Spain
    • 11.3.6 Rest of Europe
  • 11.4 Asia-Pacific
    • 11.4.1 China
    • 11.4.2 Japan
    • 11.4.3 India
    • 11.4.4 South Korea
    • 11.4.5 Rest of APAC
  • 11.5 Rest of the World
    • 11.5.1 South America
    • 11.5.2 Middle East
    • 11.5.3 Africa

• 12 Global Molded Interconnect Device (MID) Market ? Entropy
  • 12.1 New product launches
  • 12.2 M&A's, collaborations, JVs and partnerships

• 13 Global Molded Interconnect Device (MID) Market Company Profile (Key Players)
  • 13.1 Market Share, Company Revenue, Products, M&A, Developments
  • 13.2 Molex
  • 13.3 LPKF Laser & Electronics
  • 13.4 TE Connectivity
  • 13.5 HARTING
  • 13.6 Arlington Plating Company
  • 13.7 2E Mechatronic
  • 13.8 Multiple Dimensions
  • 13.9 JOHNAN
  • 13.10 MID Solutions
  • 13.11 Company 10
  • 13.12 Company 11 & more

• 14 Global Molded Interconnect Device (MID) Market - Appendix
  • 14.1 Sources
  • 14.2 Abbreviations