OVERVIEW
The Global Flip Chip Technology Market is expected to hit USD 33.53 billion by 2025, growing with a CAGR of 5.59% during the forecast period. Factors such as increasing demand for wearable devices, strong growth in MMIC (Monolithic Microwave IC) Applications are driving demand for Flip Chip Technology Market.TABLE OF CONTENT
- 1.1 Study Objectives
- 1.2 Market Definition
- 1.3 Study Scope
- 1.3.1 Markets Covered
- 1.3.2 Geographic Scope
- 2 RESEARCH METHODOLOGY
- 2.1 Research Data
- 2.1.1 Secondary Data
- 2.1.1.1 Key Data from Secondary Sources
- 2.1.2 Primary Data
- 2.1.2.1 Key Data from Primary Sources
- 2.1.2.2 Key Industry Insights
- 2.1.2.3 Breakdown of Primaries
- 2.1.1 Secondary Data
- 2.2 Market Size Estimation
- 2.2.1 Bottom-Up Approach
- 2.2.2 Top-Down Approach
- 2.3 Market Breakdown and Data Triangulation
- 2.4 Research Assumptions
- 2.1 Research Data
- 3 Global Flip Chip Technology Market – Executive Summary
- 3.1 Market Revenue, Market Size and Key Trends by Company
- 3.2 Key Trends by type of Application
- 3.3 Key Trends segmented by Geography
- 4 Global Flip Chip Technology Market – Comparative Analysis
- 4.1 Product Benchmarking - Top 10 companies
- 4.2 Top 5 Financials Analysis
- 4.3 Market Value split by Top 10 companies
- 4.4 Patent Analysis - Top 10 companies
- 4.5 Pricing Analysis
- 5 Global Flip Chip Technology Market – Industry Market Entry Scenario
- 5.1 Regulatory Framework Overview
- 5.2 New Business and Ease of Doing business index
- 5.3 Case studies of successful ventures
- 5.4 Customer Analysis – Top 10 companies
- 6 Global Flip Chip Technology Market - Market Forces
- 6.1 Introduction
- 6.2 Market Dynamics
- 6.2.1 Drivers
- 6.2.2 Opportunities
- 6.2.3 Challenges
- 6.3 Porters Analysis of Market
- 6.3.1 Bargaining power of suppliers
- 6.3.2 Bargaining powers of customers
- 6.3.3 Threat of new entrants
- 6.3.4 Rivalry among existing players
- 6.3.5 Threat of substitutes
- 7 Global Flip Chip Technology Market - Strategic Analysis
- 7.1 Value Chain analysis
- 7.2 Product Life Cycle
- 7.3 Supplier and distributor analysis (Market share and product dealing strategies)
- 8 Global Flip Chip Technology Market – By Product (Market Size – & million/billion)
- 8.1 CMOS Image Sensor
- 8.2 SoC
- 8.3 GPU
- 8.4 Memory
- 8.5 Light Emitting Diode
- 8.6 CPU
- 9 Global Flip Chip Technology Market – By Packaging Technology
- 9.1 CSP
- 9.2 BGA
- 10 Global Flip Chip Technology Market – By Wafer Bumping Process
- 10.1 Tin-Lead Eutectic Solder
- 10.2 Lead Free Solder
- 10.3 Copper Pillar
- 10.4 Gold Stud Bumping
- 11 Global Flip Chip Technology Market – By End User
- 11.1 Industrial
- 11.2 Automotive
- 11.3 Consumer Electronics
- 11.4 Military and Defense
- 11.5 Medical and Healthcare
- 11.6 Telecommunications
- 12 Global Flip Chip Technology Market – By Geography (Market Size – & million/billion)
- 12.1 Introduction
- 12.2 North America
- 12.2.1 US
- 12.2.2 Canada
- 12.2.3 Mexico
- 12.3 Europe
- 12.3.1 U.K
- 12.3.2 Germany
- 12.3.3 Italy
- 12.3.4 France
- 12.3.5 Spain
- 12.3.6 Rest of Europe
- 12.4 Asia-Pacific
- 12.4.1 China
- 12.4.2 Japan
- 12.4.3 India
- 12.4.4 South Korea
- 12.4.5 Rest of APAC
- 12.5 Rest of the World
- 12.5.1 South America
- 12.5.2 Middle East
- 12.5.3 Africa
- 13 Global Flip Chip Technology Market – Entropy
- 13.1 New product launches
- 13.2 M&A's, collaborations, JVs and partnerships
- 14 Global Flip Chip Technology Market -Company Profile (Key Players)
- 14.1 Market Share, Company Revenue, Products, M&A, Developments
- 14.2 Amkor Technology Inc.
- 14.3 GlobalFoundries U.S. Inc.
- 14.4 Chipbond Technology Corporation
- 14.5 TF AMD Microlectronics Sdn Bhd
- 14.6 Powertech Technology Inc.
- 14.7 Jiangsu Changjiang Electronics Technology Co., Ltd.
- 14.8 UTAC Holdings Ltd
- 14.9 Taiwan Semiconductor Manufacturing Company Limited
- 14.10 ASE Industrial Holding Ltd. (Siliconware Precision Industries Co., Ltd)
- 14.11 Company 10
- 14.12 Company 11 & more
- 15 Global Flip Chip Technology Market - Appendix
- 15.1 Sources
- 15.2 Abbreviation
Flip Chip Technology Market by Wafer Bumping Process (CU Pillar, Lead-Free), Packaging Technology (2D IC, 2.5D IC, 3D IC), Packaging Type (BGA, PGA, LGA, SIP, CSP), Product (Memory, LED, CPU, GPU, SOC), Application and Geography – 2022 to 2027
Category: Semiconductor & ElectronicsSKU: GMS-555
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